乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517
乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517
乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517
乐泰3517胶水/乐泰3517胶水/乐泰胶水 乐泰3517
30ML 1KG装
乐泰 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP(FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices.
Chemical Type: Epoxy
Appearance (uncured): Black liquidLMS
Components :One c o mponent - requires no mixing
Cure: Heat cure
Cure Benefit :Production - high speed curing
Application :Underfill
Specific Application :Reworkable underfill for CSP (FBGA) or BGA
Dispense Method :Syringe
Key Substrates: SMD c o mponents to PCB
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