乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517
乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517
乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517 乐泰 3517
乐泰 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP (FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices.
本公司专业提供电子胶黏剂、乐泰 乐泰胶等产品服务和相关技术咨询,欢迎广大新老朋友就电子胶黏剂、乐泰 乐泰胶等方面的问题与我们沟通交流。
技术服务热线:021-51693135 |